板材使用 |
FR-4 (Tg140℃~180℃) |
FR-4 (無鹵素) | |
FR-4 (High CTI) | |
CEM-3 | |
鋁基板5052 + 導熱膠 1~3 w/mk | |
最大工作尺寸 | 21" × 24" ( 530 mm × 610 mm ) |
成品銅厚 (oz) | 0.5~4.0 |
成品板厚 (mm) | 0.38~4.0 |
最小成品孔徑 (mm) | 0.15 |
最小線寬/距 (mil) | 3/3 |
最小隔焊 (inch) | 0.003 |
阻抗控制 (Ω) | 50~120 ± 10% |
縱橫比 | 1:8 |
成型公差 (inch) | ±0.005 |
層間對準度 (inch) | ±0.003 |
HDI (BVH & IVH) | 1+N+1 4 mil Via hole |
QA設備
Item | Equipment |
1 | 金相顯微鏡 / Gold Measuring |
2 | 阻抗測試儀 / Impedance Inspector |
3 | V-cut 殘厚儀 / Residual Thickness Inspector |
4 | 三次元量測機 / 3D Coordinate Measuring Machine |
5 | 孔、面銅量測儀 / Copper Thickness Inspector |
6 | 錫爐 / Solderability Test Pot |
7 | 標準棒 / Pin Gauge |